1. 2. 3. material content data sheet sales product name tle7738g issued 28. august 2013 ma# MA001015600 package pg-dso-52-4 weight* 872.47 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 27.549 3.16 3.16 31575 31575 leadframe inorganic material phosphorus 7723-14-0 0.073 0.01 84 non noble metal zinc 7440-66-6 0.293 0.03 335 non noble metal iron 7439-89-6 5.854 0.67 6710 non noble metal copper 7440-50-8 237.701 27.24 27.95 272445 279574 wire noble metal gold 7440-57-5 3.710 0.43 0.43 4253 4253 encapsulation organic material carbon black 1333-86-4 1.163 0.13 1332 plastics epoxy resin - 53.478 6.13 61294 inorganic material silicondioxide 60676-86-0 526.640 60.36 66.62 603617 666243 leadfinish non noble metal tin 7440-31-5 7.508 0.86 0.86 8606 8606 plating noble metal silver 7440-22-4 0.968 0.11 0.11 1109 1109 glue plastics epoxy resin - 1.885 0.22 2160 noble metal silver 7440-22-4 5.654 0.65 0.87 6480 8640 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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